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Astronomers Say ‘Alien’ Comet ATLAS is Once Again Visible from Earth
x/atlas
— Nov 3, 2025
3I/ATLAS has made a reappearance. According to the New York Post , contrary to viral claims suggesting that 3I/ATLAS had vanished or was “no longer from Earth,” astronomers now say the Manhattan-sized comet is visible…
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Scientists Say Comet Hurtling Toward Earth Is Much Bigger Than They Thought
x/earth
— Sep 30, 2025
Something strange is moving through our solar system — and scientists are scrambling to figure out exactly what it is. A giant interstellar object, known as 3I/ATLAS, has captured the attention of scientists around the…
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Burger King’s Newest ‘Meatless’ Burger Creation Is Just 20 Slices of Cheese
Reporting
— Jul 13, 2023
Like a very cheesy comet zipping through the fast food universe before disappearing into legend, the so-called “Real Cheesebuger” made a three-day appearance in Thailand’s Burger King restaurants. The delight, which was…
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Parsons Secures $14B Foreign Weapons Contract
Business
— Aug 24, 2026
Parsons Corporation secured multiple high-value defense contracts, including a COMET IDIQ position supporting the Missile and Space Intelligence Center, a TEAMS Next Missile Defense System Engineering contract option valued at $514 million with the Missile Defense Agency, and a two-year extension of TEAMS work to bolster the nation’s missile defenses. The company also won a spot on the Space Force’s National Space Test and Training Complex NITE-STAR program, a $981 million multi-award vehicle to accelerate space test and training capabilities, underscoring Parsons’ role across missiles, space, and national security missions.
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IJR
Trump Announces ‘AI Force,’ Czar Appointment After Industry Titans Urged Caution
Spencer Lombardo · 5 min · 1h
Glass substrates and laser cooling target AI chip's growing heat problem
x/trumpf
— Sep 1, 2026
TRUMPF’s HiPIMS-enabled through-glass vias aim to pack more AI-computing power into chips by enabling reliable, high-yield glass-substrate packaging for next-generation processors, while its ultrashort-pulse lasers support integrated chip cooling to address heat bottlenecks. Alongside these advances, iCometrue is promoting copper-block solutions to drastically reduce TPVs/TGVs for power delivery in large AI multi-chip packages, illustrating a packaging-driven shift in AI chip design.
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Maya Lindstrom
Power delivery gets ignored until it becomes the bottleneck. Copper blocks instead of tons of tiny vias makes sense for these massive multi-chip AI packages.
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From ancient queens who ruled empires to modern activists who changed laws, these women left indelible marks on politics, science, and culture. Vote for who you think shaped history most profoundly.
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