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CanSemi plans ChiNext IPO that could make it first wafer maker — Sep 23, 2026Guangzhou-based CanSemi Technology is seeking to raise about 6.16 billion yuan in a Shenzhen ChiNext listing, pricing shares at 12.01 yuan and selling about 512.6 million new shares (potentially up to 589.54 million with overallotment) to fund 12-inch wafer production expansion and working capital. Strategic investors including Alibaba Cloud Feitian Information Technology, Goodix Technology and Biwin Storage Technology have taken stakes, underscoring strong demand for domestic chip manufacturing amid China’s tech self-reliance push.

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